Flexible Printed Circuits (FPC) and PCB Assembly

Single and double-layer flexible circuits with precision SMT assembly. Roll-to-roll production process for high-volume manufacturing. Used in automotive electronics, medical devices, consumer electronics, and EV battery systems.

OEM / ODM ISO Certified Custom Design Fast Prototype
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Technical Specifications

ParameterValue / Range
Base MaterialPET / PI (Polyimide)
Copper Thickness0.5oz / 1oz / 2oz
Base Thickness (Single)0.013mm
Base Thickness (Double)0.025mm
Min. Line Width / Spacing0.1mm / 0.1mm
Operating Voltage≤42V / ≤25V (AC)
Contact Resistance0.5Ω ~ 10Ω
Dielectric Withstand2kV for 1 minute
Operating Temperature-20°C ~ +135°C
Surface FinishENIG / OSP / Carbon ink
Connector OptionsZIF / FFC / SMT pads
Inspection4-wire Kelvin testing
StandardsIPC-6013
Component SupportDown to 01005 size

Key Features

High Density

Supports 01005 components. Fine-pitch assembly to 0.3mm.

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Roll-to-Roll

High-volume reel-to-reel processing for mass production efficiency.

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Precision Tolerances

±0.05mm alignment. 4-wire Kelvin electrical testing.

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Fast Prototyping

3-5 day quick-turn prototypes with free design review.

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Wide Temperature Range

-20°C to +135°C. Suitable for automotive engine bay use.

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Multi-Layer Options

Single, double, and rigid-flex combo designs available.

Applications

New Energy Vehicles Foldable Phones Consumer Electronics Medical Endoscopes Sensor Arrays Wearable Devices Automotive ECUs Camera Modules

Customize This Product

We can tailor the design, materials, dimensions, and finish to your exact requirements. Send us your specifications for a free review.

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