Product Overview

三特兴 provides high-quality flexible printed circuits (FPC) with precision etching and reliable performance. Our FPCs are designed for compact electronic assemblies requiring flexible interconnections in limited spaces, offering excellent dynamic and static flex characteristics.

Key Features

• High flexibility for space-constrained designs
• Multiple layer options: single-sided, double-sided, multi-layer
• Fine line capability down to 0.1mm line width/space
• Surface finishes: Gold, ENIG, OSP, Silver
• Stiffener options: PI, FR-4, SUS for connector areas
• Excellent dynamic and static flex performance

Technical Specifications

Parameter	Value
Base Material	Polyimide (PI)
Copper Thickness	0.5oz ~ 2oz
Min Line Width/Space	0.1mm / 0.1mm
Min Hole Diameter	0.2mm
Surface Finish	ENIG, Gold, OSP
Insulation Resistance	≥100MΩ
Operating Temperature	-40°C ~ 105°C

Applications

Smartphones, tablets, cameras, LCD modules, medical devices, automotive electronics, industrial control systems, and aerospace equipment.